GaN单晶衬底2-4英寸D级R级P级独立自支撑式氮化镓晶片半导体材料
LLGaN
参数名称Item | 参数标准Specification | |||
尺寸Size | 2” | 4” | ||
直径Diameter 晶型Crystal type | 50.8±0.3mm Single | 100.0±0.3mm crystal | ||
晶面指向Orientation | (0001)Ga face | |||
斜 切 角 ( C 偏 M ) C-plane off angle toward M-axis | 0.5°±0,15° | |||
斜 切 角 ( C 偏 A ) C-plane off angle toward A-axis | 0°±0.15° | |||
002)面半峰宽(002)FW HM | <100 arcsec | |||
(102)面半峰宽(102)FW HM 曲率半径Lattice radius of curvature | <100 arcsec >10m(measured at 80%x diameter) | |||
电学参数Electricalspecification |
掺杂元素Dopingelements | 室温电阻率(300 K) Room temperature resistivity (300K) | ||
N-type(Silicon) | ≤0.05 ohm-cm | |||
UID | ≤0.2 ohm-cm | |||
Semi-Insulating(Carbon) | >1E8 ohm-cm | |||
形貌参数Shapespecification 主参考晶面向 Majorflatorientation 主参考面长度Majorflat length |
M-plane(10-10),±2°(sta 16±1mm |
ndard);±0.1°(laser grade) 32±1 mm | ||
次参考晶面 Minorflatorientation | Ga face,90°clockwise from the major orientation flat plane | |||
次参考面长度Minorflat length | 8±1 mm | 18±1 mm | ||
厚度Thickness | 400±30μm/450±30 μm | |||
总厚度变化TTV | ≤15μm | ≤30μm | ||
粗糙度Sa 弯曲度Bow | ≤0.3 nm(10 -10μm-10μm | μm×10μm) -40μm-20μm | ||
凹坑、通孔等级划分Pits grading system | Density(Pits/cm²) | 2”(pits) | 4”(pits) | |
工业级Production 研发级Research | <0.5 ≤1.5 | ≤10 ≤30 | ≤40 ≤120 | |
实 验 级 D u mm y | ≤2.5 | ≤50 | ≤200 | |
边缘轮廓Edge bevel 背面表面处理Back-side surface | Beveled Polished;Etched | |||
*可根据客户需求定制。Can be customized according to customer needs. | ||||